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Mini DIP (SPM3) Application Note (2012-07-09)
ignored due to its large value.
T j
R θjc
T c
R θch
T h
R θha
T a
P D
C jc
R θca
C ch
C ha
B eing ig no red
Transient im p ed ance
o f each sectio n
Figure 9.1 Transient thermal equivalent circuit with a heatsink.
The thermal resistance of the SPM is defined in the following equation,
R ? jc ?
T j ? T c
P D
(9.11)
where R ? jc ( o C/W) is the junction-to-case thermal resistance, and P D (W), T j ( o C) and T c ( o C) are power
dissipation per device, junction temperature and case reference temperature, respectively. By replacing T c
with T a (ambient temperature), the junction-to-ambient thermal resistance R ? ja can be obtained as following,
R ? ja ?
T j ? T a
P D
(9.12)
where R ? ja indicates the total thermal performance of the SPM including the heat sink. Basically R ? ja is
a serial summation of various thermal resistances, R ? jc , R ? ch and R ? ha .
R ? ja ? R ? jc ? R ? ch ? R ? ha
(9.13)
where R ? ch is contact thermal resistance due to the thermal grease between the package and the heat
sink, and R ? ha is heat sink thermal resistance, respectively. From the equation (9.13), it is clear that
minimizing R ? ch and R ? ha is an essential application factor to maximize the power carrying ability of the SPM
as well as the minimizing of R ? jc itself. An infinite heat sink will result if R ? ch and R ? ha are reduced to zero and
the case temperature T c is locked at the fixed ambient temperature T a . Usually, the value of R ? ch is
proportional to the thermal grease thickness and governed by the skill at the assembly site, while R ? ha can be
handled to some extent by selecting an appropriate heat sink.
In practical operation, the power loss P D is cyclic and therfore the transient RC equivalent circuit shown
in Fig. 9.1 should be considered. For pulsed power loss, the thermal capacitance effect delays the rise in
junction temperature, and thus permits a heavier loading of the SPM. Figure 9.2 shows the normalized
? 2008
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